Detergents Ultrasonic, PCMP, and Spray Cleaning

Aqueous detergents engineered to support single-wafer, batch, ultrasonic, megasonic, and spray cleaning systems.

In today’s high-precision manufacturing environments, cleaning is critical — not just for yield but for downstream integrity.

Post-process cleaning must do more than remove visible debris—it must eliminate microscopic contaminants, prevent redeposition, and prepare surfaces for bonding, coating, or packaging. But every material, tool, and process step presents its own set of challenges.

As manufacturing becomes more complex and miniaturized, effective cleaning becomes not just a final step—but a critical enabler of yield and long-term reliability.

  • Post-polish and post-dicing residues often contain abrasive particles, metal ions, or organic byproducts that can cause defects or interfere with coatings and packaging.
  • Surface tension, drying artifacts, or redeposition during wet cleaning can compromise surface quality.
  • Cleaning chemistries must be highly effective, yet material-safe, especially for delicate or high-value substrates like sapphire, gallium arsenide, or thin silicon wafers.
  • Process equipment compatibility—from ultrasonic tanks to single-wafer spin systems—requires fine-tuned foam control, temperature stability, and no harmful buildup.
  • For PCMP (Post-CMP) and advanced packaging processes, detergents must work synergistically with other chemistries in the workflow.

Intersurface Dynamics offers a range of aqueous detergents and cleaning additives engineered to support single-wafer, batch, ultrasonic, megasonic, and spray cleaning systems across the semiconductor, optics, photonics, and flat panel display industries

precision control icon

Precise control of particle removal and surface energy

material safe formulations icon

Low-residue, material-safe formulations

Support for ultrasonic, megasonic, spray, and batch systems icon

Support for ultrasonic, megasonic, spray, and batch systems

custom chemistry development icon

Custom development to meet exact process specifications

Ultrasonic & Megasonic Cleaning

  • Aqueous detergents designed for ultrasonic and megasonic equipment
  • Remove fine particles and residues without damaging substrates
  • Formulated for sensitive materials like optics, high-index glass, ceramics, and semiconductors

Key Products:
Challenge 800 Series 
Vector HTC-SCA Series
Challenge 700-HT

PCMP and Spray Cleaning

  • Low-foam chemistries designed for post-CMP and single-wafer cleaning tools
  • Ideal for removing slurry residue, particles, and chemical byproducts
  • Ensure clean, residue-free surfaces for bonding and passivation

Key Products:
Custom PCMP Cleans
Tensor DG Series
Tensor D-Rinse

Post-Process Rinse & Wet Storage

  • Additives for in-process rinsing and wet storage between critical steps
  • Help prevent particle redeposition and oxidation
  • Compatible with silicon, compound semiconductors, and advanced materials

Key Products:
Vector HTR
Challenge 700-HT

Application areas:

  • Post-lap and post-polish wafer cleaning
  • Post-dicing and singulation rinse
  • CMP and PCMP cleaning
  • Ultrasonic/megasonic tank cleaning for optics and semiconductors
  • FPD glass and solar wafer cleaning
  • Wet storage and pre-bond prep

We work closely with customers to co-develop detergents optimized for their specific equipment, materials, and goals.

Whether you need ultra-low-foaming properties, added corrosion inhibition, or compatibility with exotic materials—we’ll formulate the right chemistry for your process.

INTERSURFACE DYNAMICS - Icon only - 2-color-66d3ab

Custom Formulations

Collaborate with our experts to tailor a solution for your exact process

We offer a wide range of proven surface chemistry products—but we’re equally invested in working with customers to develop new, customized solutions tailored to address new material types, integration challenges, or process innovations.

IDI can assist with method development for preparing wafer surfaces for:

  • Downstream processing
  • Wafer to wafer bonding
  • Epitaxy
  • Processes requiring ultra low surface roughness

Projects IDI can assist with:

  • Unmet consumable technology needs
  • POR chemistry discontinuation/obsolescence
  • Importation challenges
  • Consumables compliant with defense procurement restrictions

Common Applications

  • Wafer back grinding & thinning
  • CMP & lapping for silicon, SiC, GaAs, GaN, InP, LiNbO₃
  • Post-CMP, post-dice, and post-lap cleaning
  • Surface prep for bonding, passivation, and packaging
  • Substrate shaping, cropping, and edge beveling

MADE IN THE USA

More than a supplier — we're a trusted extension of your team

IDI brings more than 40 years of hands-on experience solving real-world process challenges. Our products are manufactured in the U.S., with fast lead times, responsive support, and a collaborative approach that ensures the chemistry fits your process—not the other way around.

IDI is more than a supplier—we're a trusted extension of your team, focused on helping you solve challenges and improve results. We work closely with you to recommend, refine, or custom-develop solutions that optimize performance, reduce waste, and keep your operations running smoothly.

  • U.S.-Based Production
  • Fast Turnaround and Response Times
  • Application-Specific Solutions
  • Collaborative, Expert Support
  • Proven Results Across Industries
Made in the USA
Made in the USA

Get the Right Chemistry for Your Process

We specialize in application-specific solutions—tailored to your materials, process, and performance goals. Whether you need help selecting the right product or developing a custom formulation, our experts are here to help.

Intersurface Dynamic’s Bethel, CT manufacturing facility is ISO-9001:2015 registered. This commitment to quality combined with our advanced manufacturing techniques has produced a record of reliable and timely service for for our customers.

Expert Solutions, Engineered for You

Specialized Solutions for Advanced Semiconductor Fabrication

Amtech Semiconductor Fabrication Solutions is a division of Amtech Systems, Inc., a global provider of equipment and materials for the semiconductor industry. This segment supplies capital equipment and consumables used throughout the semiconductor fabrication process—including advanced packaging and electronics manufacturing—covering everything from substrate processing to final assembly.

The Intersurface Dynamics, Entrepix, and PR Hoffman brands of Amtech Semiconductor Fabrication Solutions stand out for their commitment to custom solutions — whatever the customer needs, they deliver. Beyond customization, their competitive edge lies in responsiveness emphasizing quick turnaround times to meet customer demands. Additionally, each brand operates with a deep, process-specific focus, bringing together specialists within closely related fields. This structure ensures that customers benefit from true expertise tailored to their specific manufacturing challenges.

At Amtech Semiconductor Fabrication Solutions, we empower your manufacturing process through expert collaboration. Our specialized subsidiaries—Intersurface Dynamics, PR Hoffman, and Entrepix—bring unparalleled expertise in application-specific chemicals, polishing and lapping templates, and CMP-related upgrades. As a nimble and responsive company, we excel in forming rapid partnerships, allowing us to customize solutions that address your unique challenges. Together, we enhance every critical step of your semiconductor, compound semiconductor, and substrate manufacturing processes, driving innovation and precision.

Semiconductor Substrate Manufacturing Process

Featured Products

CHALLENGE 700-HT

Additives for Post-Lap/Polish Rinse and In-Process Wet Storage of Parts

CHALLENGE 800 Series

Aqueous Detergents For Ultrasonic/Megasonic Cleaning

CHALLENGE 900 Series

Low Foam Detergents for Cleaning FPD Glass and Solar Wafers

Custom PCMP Cleans

Fully formulated cleaning chemistries made to your specifications

TENSOR D-Rinse

Additive For High Pressure Pad Rinse/Wafer De-Chucking Cycles

TENSOR DG Series

Cleaning Solutions for IC Manufacturing

VECTOR HTC-SCA Series

Ultrasonic/Megasonic Detergents

VECTOR HTR

Additive for Rinsing Silicon Wafers — Post-Lapping/Polishing, Sawing and Texturing

Get the Right Chemistry for Your Process

Tailored solutions start with a conversation. Whether you need help selecting a product or developing a custom formulation, our experts are here to help.