In today’s high-precision manufacturing environments, cleaning is critical — not just for yield but for downstream integrity.
Post-process cleaning must do more than remove visible debris—it must eliminate microscopic contaminants, prevent redeposition, and prepare surfaces for bonding, coating, or packaging. But every material, tool, and process step presents its own set of challenges.
As manufacturing becomes more complex and miniaturized, effective cleaning becomes not just a final step—but a critical enabler of yield and long-term reliability.
Intersurface Dynamics offers a range of aqueous detergents and cleaning additives engineered to support single-wafer, batch, ultrasonic, megasonic, and spray cleaning systems across the semiconductor, optics, photonics, and flat panel display industries
Precise control of particle removal and surface energy
Low-residue, material-safe formulations
Support for ultrasonic, megasonic, spray, and batch systems
Custom development to meet exact process specifications
Ultrasonic & Megasonic Cleaning
- Aqueous detergents designed for ultrasonic and megasonic equipment
- Remove fine particles and residues without damaging substrates
- Formulated for sensitive materials like optics, high-index glass, ceramics, and semiconductors
Key Products:
Challenge 800 Series
Vector HTC-SCA Series
Challenge 700-HT
PCMP and Spray Cleaning
- Low-foam chemistries designed for post-CMP and single-wafer cleaning tools
- Ideal for removing slurry residue, particles, and chemical byproducts
- Ensure clean, residue-free surfaces for bonding and passivation
Key Products:
Custom PCMP Cleans
Tensor DG Series
Tensor D-Rinse
Post-Process Rinse & Wet Storage
- Additives for in-process rinsing and wet storage between critical steps
- Help prevent particle redeposition and oxidation
- Compatible with silicon, compound semiconductors, and advanced materials
Key Products:
Vector HTR
Challenge 700-HT
Application areas:
We work closely with customers to co-develop detergents optimized for their specific equipment, materials, and goals.
Whether you need ultra-low-foaming properties, added corrosion inhibition, or compatibility with exotic materials—we’ll formulate the right chemistry for your process.
Get the Right Chemistry for Your Process
We specialize in application-specific solutions—tailored to your materials, process, and performance goals. Whether you need help selecting the right product or developing a custom formulation, our experts are here to help.
Expert Solutions, Engineered for You
Specialized Solutions for Advanced Semiconductor Fabrication
Amtech Semiconductor Fabrication Solutions is a division of Amtech Systems, Inc., a global provider of equipment and materials for the semiconductor industry. This segment supplies capital equipment and consumables used throughout the semiconductor fabrication process—including advanced packaging and electronics manufacturing—covering everything from substrate processing to final assembly.
The Intersurface Dynamics, Entrepix, and PR Hoffman brands of Amtech Semiconductor Fabrication Solutions stand out for their commitment to custom solutions — whatever the customer needs, they deliver. Beyond customization, their competitive edge lies in responsiveness emphasizing quick turnaround times to meet customer demands. Additionally, each brand operates with a deep, process-specific focus, bringing together specialists within closely related fields. This structure ensures that customers benefit from true expertise tailored to their specific manufacturing challenges.
At Amtech Semiconductor Fabrication Solutions, we empower your manufacturing process through expert collaboration. Our specialized subsidiaries—Intersurface Dynamics, PR Hoffman, and Entrepix—bring unparalleled expertise in application-specific chemicals, polishing and lapping templates, and CMP-related upgrades. As a nimble and responsive company, we excel in forming rapid partnerships, allowing us to customize solutions that address your unique challenges. Together, we enhance every critical step of your semiconductor, compound semiconductor, and substrate manufacturing processes, driving innovation and precision.
Semiconductor Substrate Manufacturing Process
Input Substrate
- Si (silicon)
- SiC (silicon carbide)
- GaN (gallium nitride)
- GaAs (gallium arsenide)
- InP (indium phosphide)
- Glass
- Sapphire
Output
Finished Wafer or Substrate
Featured Products
Get the Right Chemistry for Your Process
Tailored solutions start with a conversation. Whether you need help selecting a product or developing a custom formulation, our experts are here to help.