Products

Find the Right Chemistry for Your Process

From grinding and polishing to cleaning and dicing, Intersurface Dynamics offers a comprehensive portfolio of process chemistries engineered for performance, compatibility, and consistency. Whether you need a proven formulation or a custom blend, we’re here to help you optimize results at every step.

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Process-Engineered Chemistries by Application and Industry

Use the matrix to identify solutions aligned with your process parameters, or navigate to individual product pages for technical data and use recommendations.

Industry	Coolants		Lapping and Polishing		Detergents
Industry	Product	Type	Product	Type	Product	Type
Semiconductors	Vector HTG	Grinding Fluid	Vector HTS	Lapping and polishing vehicle	Vector HTR	Wet Storage
	Tensor HTD	Dicing Fluid	Custom CMP Slurries	Fully formulated slurry	Vector HTC-SCA	Ultrasonic Detergent
	Vector HTI-1.1	Wire-saw Lubricant/Coolant	Vector TXT	Diamond Slurry Base	Tensor DG	Spray Detergent
			Vector Series C-E	SiC Diamond Slurry	Tensor D-Rinse	Rinse Agent and Dechuck Fluid
					Custom PCMP Cleans	PCMP Cleaner
Optical Specialty Materials	Challenge 300 Series	Grinding Fluid	Challenge 550 Series	Lapping vehicles	Challenge 700-HT	Wet Storage
	Challenge 300-CR	Grinding Fluid	Challenge 543-HT	Slurry Additive	Challenge 800 Series	Ultrasonic Detergent
	Challenge 361-HT	Grinding Fluid			Challenge 900 Series	Rinse Agent
	Mercury 1000	Saw Blade Coolant

All

All
Coolants
Detergents
Lapping and Polishing

CHALLENGE 300 Series

Synthetic Grinding Fluids

CHALLENGE 300-CR

Synthetic Generating Coolant for Plastic & Glass Lenses

CHALLENGE 361-HT

Synthetic Grinding Fluid for Ceramic and Optical Materials

CHALLENGE 543-HT

Lapping/Polishing Slurry Additives for Suspending Non-Treated Abrasive

CHALLENGE 550 Series

Lapping/Polishing Slurry Additives for Suspending Non-Treated Abrasive

CHALLENGE 700-HT

Additives for Post-Lap/Polish Rinse and In-Process Wet Storage of Parts

CHALLENGE 800 Series

Aqueous Detergents For Ultrasonic/Megasonic Cleaning

CHALLENGE 900 Series

Low Foam Detergents for Cleaning FPD Glass and Solar Wafers

Custom CMP Slurries

Fully formulated slurries made to your specifications

Custom PCMP Cleans

Fully formulated cleaning chemistries made to your specifications

MERCURY 1000

Synthetic Grinding Fluid

TENSOR D-Rinse

Additive For High Pressure Pad Rinse/Wafer De-Chucking Cycles

TENSOR DG Series

Cleaning Solutions for IC Manufacturing

TENSOR HTD Series

Dicing/Back-Grinding Coolants/Lubricants with Anti-Corrosion and ESD Suppression Additives

VECTOR HTC-SCA Series

Ultrasonic/Megasonic Detergents

VECTOR HTG

Synthetic Grinding Fluid

VECTOR HTI-1.1

Synthetic Cooolant/Lubricant for Silicon Cropping, Sawing, and Edge-Grinding in Non-Recirculating Applications

VECTOR HTR

Additive for Rinsing Silicon Wafers — Post-Lapping/Polishing, Sawing and Texturing

VECTOR HTS Series

Lapping/Polishing Slurry Additives for Semiconductor Materials

VECTOR Series C-E Diamond Slurries

C-E Diamond Slurry Developed Specifically for Silicon Carbide

VECTOR TXT

Removal Rate Enhancing Base for Diamond Slurry Production

INTERSURFACE DYNAMICS - Icon only - 2-color-66d3ab

Custom Formulations

Collaborate with our experts to tailor a solution for your exact process

We offer a wide range of proven surface chemistry products—but we’re equally invested in working with customers to develop new, customized solutions tailored to address new material types, integration challenges, or process innovations.

IDI can assist with method development for preparing wafer surfaces for:

Downstream processing
Wafer to wafer bonding
Epitaxy
Processes requiring ultra low surface roughness

Projects IDI can assist with:

Unmet consumable technology needs
POR chemistry discontinuation/obsolescence
Importation challenges
Consumables compliant with defense procurement restrictions

Common Applications

Wafer back grinding & thinning
CMP & lapping for silicon, SiC, GaAs, GaN, InP, LiNbO₃
Post-CMP, post-dice, and post-lap cleaning
Surface prep for bonding, passivation, and packaging
Substrate shaping, cropping, and edge beveling