Precision Cooling for Demanding Surface Processes
Grinding, wiresawing, and dicing are among the most aggressive steps in semiconductor, optics, and advanced materials manufacturing. While they’re essential to shaping wafers, substrates, or lenses, they also pose significant risks — generating significant heat and mechanical stress.
Modern processes demand coolants that are chemically engineered for performance, compatibility, and ease of maintenance across a growing variety of substrates and equipment types.
IDI’s synthetic coolants are engineered to provide excellent heat transfer, lubrication, and material compatibility—across grinding, wiresaw, and dicing applications.
Our synthetic coolants reduce foam, resist contamination, and extend service intervals for critical process equipment.
Available in water-soluble, non-foaming, and non-toxic formulations, our coolants are effective across silicon, sapphire, SiC, glass, and other materials—delivering superior results in surface quality, tool life, and uptime.
With non-toxic, water-based formulations, they’re easy to clean, safe to handle, and designed to work seamlessly across process steps—whether you’re slicing silicon wafers or dicing optical glass lenses.
Non-toxic, water-based, and easy to clean
Non-foaming in recirculating systems
Low VOC and operator safe
Proven performance across silicon, SiC, sapphire, and glass
Grinding, Backgrinding, and Cropping
- Formulated for high lubricity and thermal dissipation
- Extend wheel life and prevent surface burning or microfractures
- Clean-rinsing and low-residue for wafer thinning and surface prep
Key Products:
Challenge 300 Series
Vector HTG
Tensor HTD Series
Mercury 1000
Dicing & Singulation
- Suppress electrostatic discharge (ESD) and resist corrosion
- Compatible with hard and brittle materials including glass, ceramics, and compound semiconductors
- Designed for high-speed, precision sawing and blade cooling
Key Products:
Tensor HTD Series
Wiresawing
- Excellent heat transfer and lubrication for multi-wire and single-wire saws
- Safe for silicon, sapphire, and other brittle materials
- Reduce saw mark defects and contamination in block cropping, squaring, and slicing
Key Products:
Vector HTI-1.1
Challenge 361-HT
Application areas:
We work closely with customers to co-develop coolants optimized for their specific equipment, materials, and goals.
Whether you need enhanced lubricity, anti-corrosion protection, or compatibility with exotic substrates, we’ll formulate the right chemistry for your process.
Collaborate with our experts to tailor a solution for your exact process
We offer a wide range of proven surface chemistry products—but we’re equally invested in working with customers to develop new, customized solutions tailored to address new material types, integration challenges, or process innovations.
IDI can assist with method development for preparing wafer surfaces for:
- Downstream processing
- Wafer to wafer bonding
- Epitaxy
- Processes requiring ultra low surface roughness
Projects IDI can assist with:
- Unmet consumable technology needs
- POR chemistry discontinuation/obsolescence
- Importation challenges
- Consumables compliant with defense procurement restrictions
Common Applications
MADE IN THE USA
More than a supplier — we're a trusted extension of your team
IDI brings more than 40 years of hands-on experience solving real-world process challenges. Our products are manufactured in the U.S., with fast lead times, responsive support, and a collaborative approach that ensures the chemistry fits your process—not the other way around.
IDI is more than a supplier—we're a trusted extension of your team, focused on helping you solve challenges and improve results. We work closely with you to recommend, refine, or custom-develop solutions that optimize performance, reduce waste, and keep your operations running smoothly.
Get the Right Chemistry for Your Process
We specialize in application-specific solutions—tailored to your materials, process, and performance goals. Whether you need help selecting the right product or developing a custom formulation, our experts are here to help.
Intersurface Dynamic’s Bethel, CT manufacturing facility is ISO-9001:2015 registered. This commitment to quality combined with our advanced manufacturing techniques has produced a record of reliable and timely service for for our customers.
Expert Solutions, Engineered for You
Specialized Solutions for Advanced Semiconductor Fabrication
Amtech Semiconductor Fabrication Solutions is a division of Amtech Systems, Inc., a global provider of equipment and materials for the semiconductor industry. This segment supplies capital equipment and consumables used throughout the semiconductor fabrication process—including advanced packaging and electronics manufacturing—covering everything from substrate processing to final assembly.
The Intersurface Dynamics, Entrepix, and PR Hoffman brands of Amtech Semiconductor Fabrication Solutions stand out for their commitment to custom solutions — whatever the customer needs, they deliver. Beyond customization, their competitive edge lies in responsiveness emphasizing quick turnaround times to meet customer demands. Additionally, each brand operates with a deep, process-specific focus, bringing together specialists within closely related fields. This structure ensures that customers benefit from true expertise tailored to their specific manufacturing challenges.
At Amtech Semiconductor Fabrication Solutions, we empower your manufacturing process through expert collaboration. Our specialized subsidiaries—Intersurface Dynamics, PR Hoffman, and Entrepix—bring unparalleled expertise in application-specific chemicals, polishing and lapping templates, and CMP-related upgrades. As a nimble and responsive company, we excel in forming rapid partnerships, allowing us to customize solutions that address your unique challenges. Together, we enhance every critical step of your semiconductor, compound semiconductor, and substrate manufacturing processes, driving innovation and precision.
Semiconductor Substrate Manufacturing Process
Input Substrate
- Si (silicon)
- SiC (silicon carbide)
- GaN (gallium nitride)
- GaAs (gallium arsenide)
- InP (indium phosphide)
- Glass
- Sapphire
Output
Finished Wafer or Substrate
Featured Products
Get the Right Chemistry for Your Process
Tailored solutions start with a conversation. Whether you need help selecting a product or developing a custom formulation, our experts are here to help.