Our capabilities span the full surface finishing process, supporting both well-established workflows and next-generation applications.
Whether you need a proven product or a customized formulation, we deliver solutions that integrate seamlessly with your materials, tools, and process requirements.
Every solution is manufactured in our ISO 9001:2015-certified U.S. facility and backed by responsive technical support.
With decades of hands-on experience and deep process expertise, our team works closely with customers to optimize yield, surface quality, and operational efficiency—across semiconductors, optics, glass, and advanced materials.
Strategic Partnership with Entrepix CMP Foundry
Intersurface Dynamics customers also benefit from our close collaboration with the Entrepix CMP Foundry, a specialized facility for Chemical Mechanical Polishing (CMP) process development and wafer finishing. Through this partnership, we offer:
- CMP process development for patterned and blanket wafers
- Prototyping and consumable screening
- Support for all wafer sizes (coupon to 200mm)
- CMP for Si, SiC, III-V, photonic and IC devices
- Post-CMP cleaning and inspection
- Grinding, lapping, coring, beveling, scribing, and film deposition services
By integrating custom chemistry from IDI into CMP process trials at Entrepix, clients accelerate development cycles, validate new materials, and gain deeper insight into process behavior—all with fewer risks and greater flexibility.
Collaborate with our experts to tailor a solution for your exact process
We offer a wide range of proven surface chemistry products—but we’re equally invested in working with customers to develop new, customized solutions tailored to address new material types, integration challenges, or process innovations.
IDI can assist with method development for preparing wafer surfaces for:
- Downstream processing
- Wafer to wafer bonding
- Epitaxy
- Processes requiring ultra low surface roughness
Projects IDI can assist with:
- Unmet consumable technology needs
- POR chemistry discontinuation/obsolescence
- Importation challenges
- Consumables compliant with defense procurement restrictions
Common Applications
Expert Solutions, Engineered for You
Specialized Solutions for Advanced Semiconductor Fabrication
Amtech Semiconductor Fabrication Solutions is a division of Amtech Systems, Inc., a global provider of equipment and materials for the semiconductor industry. This segment supplies capital equipment and consumables used throughout the semiconductor fabrication process—including advanced packaging and electronics manufacturing—covering everything from substrate processing to final assembly.
The Intersurface Dynamics, Entrepix, and PR Hoffman brands of Amtech Semiconductor Fabrication Solutions stand out for their commitment to custom solutions — whatever the customer needs, they deliver. Beyond customization, their competitive edge lies in responsiveness emphasizing quick turnaround times to meet customer demands. Additionally, each brand operates with a deep, process-specific focus, bringing together specialists within closely related fields. This structure ensures that customers benefit from true expertise tailored to their specific manufacturing challenges.
At Amtech Semiconductor Fabrication Solutions, we empower your manufacturing process through expert collaboration. Our specialized subsidiaries—Intersurface Dynamics, PR Hoffman, and Entrepix—bring unparalleled expertise in application-specific chemicals, polishing and lapping templates, and CMP-related upgrades. As a nimble and responsive company, we excel in forming rapid partnerships, allowing us to customize solutions that address your unique challenges. Together, we enhance every critical step of your semiconductor, compound semiconductor, and substrate manufacturing processes, driving innovation and precision.
Semiconductor Substrate Manufacturing Process
Input Substrate
- Si (silicon)
- SiC (silicon carbide)
- GaN (gallium nitride)
- GaAs (gallium arsenide)
- InP (indium phosphide)
- Glass
- Sapphire
Output
Finished Wafer or Substrate
Intersurface Dynamic’s Bethel, CT manufacturing facility is ISO-9001:2015 registered. This commitment to quality combined with our advanced manufacturing techniques has produced a record of reliable and timely service for for our customers.
