CHALLENGE 550 Series
Lapping/Polishing Slurry Additives for Suspending Non-Treated Abrasive
CHALLENGE 550-HT Non-Suspension Type Lapping/Polishing Slurry Additive for Recirculating Systems
Challenge 550-HT was developed for use in “high-speed recirculating” slurry application during lapping and polishing processes. Utilizing the energy of a high speed circulating pump, standard on most lapping machines, it evenly disperses aluminum oxide, cerium oxide, silicon carbide, boron carbide, and garnet abrasive. It also reduces abrasive usage by eliminating “hard-packing” of the abrasive in the slurry tank and the slurry lines. Using CHALLENGE 550-HT will also produce cleaner parts making the downstream cleaning line more efficient.
Typical Applications:
Single and double sided lapping/polishing for recirculating systems
Typical Properties:
- pH - 10.0
- Conductivity Ms - 0.3
- Specific Gravity - 1.02
Directions:
CHALLENGE 550-HT is used at approximately 3- 5% (by weight) with deionized (DI) water or tap water that is not excessively hard. After CHALLENGE 550-HT is mixed with the water in the slurry tank, add the abrasive. The slurry will be ready for use almost immediately. Start grain loading 400 g/liter for a one-meter machine. Flow rate for the slurry should be approximately 300ml/minute for a one-meter machine.
Benefits:
No scratching
Less sub-surface damage
No hard-packing
Less abrasive waste
Increased removal rate
Easier post-lap cleaning
Non-corrosive to machine
CHALLENGE 557-HT Slurry Additive for Cerium and Alumimun Oxide Polishing Slurries
CHALLENGE 557-HT is an aqueous based slurry additive designed to be added to cerium oxide and aluminum oxide polishing slurries. The nature of polishing slurries and their sub-micron particle sizes creates post-polish cleaning issues. High precision optical parts may be polished to the correct specifications using standard slurries but cleaning the slurry particles from the surface of the parts is difficult and can result in damaged or rejected parts. Adding CHALLENGE 557-HT to the polishing slurry allows for that slurry to be more easily cleaned from the glass or ceramic surface. Also, CHALLENGE 557-HT eliminates staining issues and burnishing marks. CHALLENGE 557-HT may also be used with other polishing slurries for similar results.
Typical Applications:
Polishing applications using cerium oxide and aluminum oxide slurries for Precision Optics, Ophthalmic Lenses, Flat Panel Display materials, Glass Disks, and other precision polished parts.
Typical Properties:
- pH - 13.0
- Conductivity Ms - 16.5
- Specific Gravity - 1.02
CHALLENGE 557-HT is also available with a neutral pH (CHALLENGE 557-HT-7) and a pH of 10 (CHALLENGE 557-HT-10).
Directions:
CHALLENGE 557-HT is used at a concentration of between 2-3% by volume of slurry. Add CHALLENGE 557-HT to the pre-mixed slurry. The slurry will be ready for immediate use.
Benefits:
Better dispersions
Eliminates staining
Less sub-surface damage
Easier post-polish cleaning
Non-corrosive to machine
CHALLENGE 557-S Slurry Additive for Cerium and Alumimun Oxide Polishing Slurries
Challenge 557-S is an aqueous based slurry additive designed to be added to cerium oxide and aluminum oxide polishing slurries to eliminate light scratching and increase removal rate. Additionally, the nature of polishing slurries and their sub-micron particle sizes creates post-polish cleaning issues. High precision optical parts may be polished to the correct specifications using standard slurries but cleaning the slurry particles from the surface of the parts is difficult and can result in damaged or rejected parts. Adding CHALLENGE 557-S to the polishing slurry allows for that slurry to be more easily cleaned from the glass or ceramic surface. Also, CHALLENGE 557-S eliminates staining issues and burnishing marks. CHALLENGE 557-S may also be used with other polishing slurries for similar results.
Typical Applications:
Polishing applications using cerium oxide and aluminum oxide slurries for Precision Optics, Ophthalmic Lenses, Flat Panel Display materials, Glass Disks, and other precision polished parts.
Typical Properties:
- pH - 12.0
- Conductivity Ms - 6.1
- Specific Gravity - 1.01
Directions:
CHALLENGE 557-S is used at a concentration of between 2-3% by volume of slurry. Add CHALLENGE 557-S to the pre-mixed slurry. The slurry will be ready for immediate use.
Benefits:
Eliminates light scratching
Increased removal rate
Better dispersions
Eliminates staining
Less sub-surface damage
Easier post-polish cleaning
Non-corrosive to machine
Additional Information:
CHALLENGE Products are available in 5-gallon pails and 55-gallon drums, F.O.B. Bethel, Connecticut, and also include: grinding fluids, sawing fluids, lapping/polishing slurry additives, rinse/ wet storage additives and ultrasonic/megasonic detergents. Safety Data Sheets available upon request.