Custom CMP Slurries
Fully formulated slurries made to your specifications
CMP Products are abrasive slurries made of tightly sized, ultra-high purity, 50-200 nm size metal-oxide particles. The slurries are optimized by application and formulated for compatibility with the materials being polished and optimal removal rate and selectivity. Particles dispersed in a special polymer matrix with wetting agents and flow control additives for optimal stability and easy removal after the CMP process is complete.
Have a CMP application that requires expert assistance?
Our team can help you with a customized solution that addresses:
- Low volume applications requiring a customer solution
- Obsolescence of currently qualified products
- Importation challenges or US sourcing requirements
Our process
Intersurface Dynamics has access to the CMP technology lab at our sister company Entrepix.
This allows us to screen potential CMP consumables and processes directly on customer wafers and deliver a turn-key process to our customers supported by meaningful application data.
Our quality lab is also equipped to provide all analyses expected for sensitive semiconductor applications. These measurements include: trace metals by ICP-OES, pH and conductivity, viscosity, and particle size measurements by request.
Off-the-Shelf products include the Vector TXT Slurry Base which is used as received and blended with customer supplied diamond and is the most versatile and economical solution. Vector CE Diamond Slurries can be purchased premixed with diamond.
Benefits:
Adjustable removal rate of films
Tunable selectivity in situations where multiple materials are present on wafer
Customizable to achieve target wafer topography
Low defectivity on metal and oxide films
Fully compatible with low k dielectrics, oxides, compound materials, and other films found in advanced semiconductor integrations
Safe and economical to use
ISO certified program and fully capable quality inspection lab