To find out how Intersurface Dynamics' application specific
chemicals can help improve the varied manufacturing processes
found in your industry select the appropriate folder below:
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Tensor HTD-4 Dicing Coolant Completely Eliminates Electrostatic Discharge During the Process Protecting Sensitive Devices
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Aqueous Cleaner Tensor Clean/Rinse 3 Removes All Cu and Barrier Film Complexes on Wafers, Pads and Polishing Tool Surfaces.
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Thinning TSV wafers through back-grinding process improved through the use of novel coolant / lubricant / corrosion inhibitor, TENSOR HTD-3.
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TENSOR D-Rinse greatly enhances post-CMP cleans by effective removal of slurry and pad residue from the wafer prior to entering the CMP cleaning steps.
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Major IC packager reports elimination of formation of oxide on exposed Al/Cu bond pads during dicing through implementation of TENSOR HTD coolant water additive.
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A new way to reduce surface roughness produced from caustic etching applicable to silicon wafer producers, MEMS manufactures and solar wafer makers. Intersurface Dynamics is proud to announce that it has been awarded patent 7,192,886 by the USPTO.
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