To find out how Intersurface Dynamics' application specific
chemicals can help improve the varied manufacturing processes
found in your industry select the appropriate folder below:
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NanoPolish 3, a new generation of lapping/polishing additive for the manufacture of diamond slurries, is in production use at a major manufacture of single crystal silicon carbide wafers for both lapping and polishing processes.
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A new way to reduce surface roughness produced from caustic etching applicable to silicon wafer producers, MEMS manufactures and solar wafer makers. Intersurface Dynamics is proud to announce that it has been awarded patent 7,192,886 by the USPTO.
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TENSOR D-Rinse greatly enhances post-CMP cleans by effective removal of slurry and pad residue from the wafer prior to entering the CMP cleaning steps.
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Major IC packager reports elimination of formation of oxide on exposed Al/Cu bond pads during dicing through implementation of TENSOR HTD coolant water additive.
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