Industry Leaders in Application-specific Chemicals
Intersurface Dynamics focuses on the complex problems inherent in producing today’s most sophisticated ICs, with expertise in the process areas of ash/etch, planarization and packaging. This expertise has resulted in highly developed chemistry for post-etch/ash residue removal and post-etch/ash residue removal rinse; chemical mechanical polishing and post-CMP cleaning; back grinding and back lapping, dicing/singulation and post-dice cleaning/passivation rinse.Tensor Series
Our VECTOR Series products are used in many of the processes used to convert the ingot of semiconductor material to the finished wafer. There is a product for each of the following processes: Cropping, OD Grinding, Notch or Flat Grinding, ID Sawing, Diamond Wire Sawing, Edge Grinding, Lapping, Wafer Grinding, and Post-Polish Wafer Rinsing. Intersurface Dynamics also manufactures a VECTOR Series Detergent used to clean the material after each process is complete.Vector Series
Once an optical component or ceramic device is rough-formed or grown, it goes through any number of processes, including edge grinding, surface grinding, I.D. or O.D. sawing and dicing, lapping, polishing, cleaning and coating. The result is a high-quality finished part used in satellite-based optics, laser components, armor plating and other critical technology applications. Intersurface Dynamics manufactures the coolants/lubricants needed for the high-speed, automated and highly precise processes used to produce these parts and components.Challenge Series
Since manufacturers of large LCDs often reject up to 40 percent of the panels that come off the assembly line, process advancements – many related to application-specific chemicals – are essential to the industry’s future success in terms of bigger, more affordable displays. Intersurface Dynamics has a variety of products designed to enhance the manufacture of both the display glass and the liquid crystal display (LCD) component of a flat panel display.Challenge Series
The trend in lens materials has also moved from glass to polycarbonate, hard resins and high-index plastics. Although these materials are lighter than glass, they offer significantly better impact resistance. However, as they scratch more easily than glass, many require hard coatings. Typical lens manufacturing processes include the following: generating/grinding; fining/polishing; edge grinding and cleaning prior to coating.Challenge Series
Polishing is often performed to achieve a highly flat, uniform or glossy surface with low surface roughness. Final step specialty coatings, such as anti-glare coatings, color tinting or the special reflective coatings designed for mirrors used in technical and laboratory applications, require an ultra-clean glass surface for optimal adhesion, and call for cleaning processes ranging from ultrasonic to manual cleaning. Intersurface Dynamics manufactures a complete range of products designed to increase the efficiency of flat glass and mirror processing applications in terms of throughput, quality and, where applicable, tool life.Challenge Series
Like cropping, squaring is an abrasive sawing process. Squaring saws or “squarers” convert the ingots into blocks. Modern squarers use diamond-coated wire cooled by a specialized coolant lubricant to perform the task of sawing. Older squarers had utilized silicon carbide slurry as an abrasive. This slurry is fed onto wires which then perform the task of sawing. Conversion to the newer type of diamond-coated technology allows for a two-fold reduction in process time. Also, the fixed diamond wire process is much cleaner and produces less waste allowing for simpler and more environmentally friendly processing.
After the ingot is squared into a block, the edges are beveled or edge-ground using a diamond grinding wheel cooled and lubricated to avoid creation of high temperatures and chipping of the surface.
After the “squared” block has been beveled it is mounted on a beam. The beam is then fed into a traditional silicon carbide slurry fed wire saw and sawn into thin wafers. After the “wafering” process is complete the wafers are rinsed free of gross amounts of slurry/silicon residue “swarf” and demounted from the beam. After demounting, the wafers are cleaned in a combination of ultrasonic and spray-cleaning apparatus. The wafers are then sold to a customer as “as cut” wafers or the wafers remain in the factory for further processing (texturing, etching, etc.) depending on the factory’s capabilities. Eventually, the silicon wafer is converted into a photovoltaic cell converting light to electricity.Challenge Series