Silicon Wafer
Post-Lap Rinsing

After lapping is completed, the top lapping plate lifts off of the bottom plate and swings away from the work area.  At this point, the wafers must be removed from the plate in a timely fashion, in order to minimize down-stream cleaning problems due to dried slurry.  Use of a post-lap rinse can extend this critical process window, and is comprised of feeding a post-lap rinsing detergent/corrosion inhibitor through the slurry lines as pressure is ramped down. This chemistry helps to break the stiction between the silicon and the lapping plates, while rinsing debris from the wafer surface for easier-to-clean wafers.  Additionally, the same post-lap chemistry should be used to rinse the wafers as they are removed from the lap, and as a bath to store them in for transfer to the clean line.  Adherence to these simple steps adds up to cleaner wafers and better process control.



Vector HTR
ADDITIVE FOR RINSING POST-LAPPED, POST-POLISHED, POST-SAWED (CROPPING, SQUARING, WAFERING) AND POST-TEXTURED SILICON WAFERS INCLUDING MULTI-CRYSTAL AND SINGLE CRYSTAL WAFERS FOR PV APPLICATIONS