Silicon Wafer
Surface Grinding

Although initially considered an alternative to lapping, surface grinding is now used in combination with lapping to achieve a desired wafer flatness and surface morphology prior to etching.

 The use of a grinding fluid is necessary to keep the wafer and chuck at a consistent temperature and free of debris, for a consistent, smooth surface finish. Keeping the chuck and wafer debris-free, both prior to and after the grinding process, is also a must in avoiding wafer breakage and grinding defects. Finally, the proper grinding fluid will also prolong the life of the diamond wheel by preventing premature fracturing of the diamond matrix.

Regardless of where surface grinding is used in a silicon wafer shaping facility, the use of an Intersurface Dynamics grinding fluid will provide the lubrication and cleaning needed to achieve optimum process results over an extended period of time.

Vector HTG