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Certified By: ISO 9001:2015
Silicon Wafer

I.D. Sawing

I.D., or annular, sawing is a widely used for slicing a silicon ingot into wafers, although wire sawing is replacing it in many larger diameter applications. The I.D. saw blade is a large, round piece of tempered stainless steel with a hole in the middle. The hole accommodates the silicon ingot and is coated with industrial diamonds to form an abrasive surface.  The blade spins at a high rpm as it is lowered into the silicon.  Once the silicon is cut through, the blade lifts, the ingot indexes and a new wafer is cut.

 It is extremely important to cool, lubricate and clean the I.D. blade in order to avoid deflection of a dull cutting surface into the wafer, which results in poor wafer geometry.  Wafer geometry correlates directly to the efficacy of an I.D. sawing coolant/lubricant, as poor geometry is a result of poor blade life due to insufficient cooling, lubrication or cleaning. A coolant/lubricant is also necessary to protect machine parts from corrosion at an in-use dilution of ~500 parts water to one part coolant/lubricant (500:1). Intersurface Dynamics’ sawing fluid is proven to provide these process benefits, for the highest quality process results.



Vector HTG
SYNTHETIC GRINDING FLUID


Vector HTI-1.1
"ONCE-THROUGH" NON RE-CIRCULATING SYNTHETIC COOLANT/LUBRICANT FOR FIXED DIAMOND ABRASIVE CROPPING AND SQUARING OF SILICON INGOTS USING ID, BAND AND WIRE SAWS. MAY ALSO BE USED AS A NON RE-CIRCULATING EDGE GRINDING COOLANT/LUBRICANT








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