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Wafering

Transforming a single crystal ingot or a squared poly-crystalline slab of silicon into individual wafers is termed “wafering”.  The newest process for wafering is “diamond wire sawing”.  Diamond wire sawing uses a machine similar to a slurry saw.  The difference between the two types of saws are that the slurry saw uses a brass coated wire and an abrasive slurry (silicon carbide) to perform the cutting while a diamond wire saw uses a diamond coated wire and specialized coolants/lubricants to perform the cutting. 

The advantages of using a diamond coated wire and coolant in place of a brass coated wire and abrasive slurry are:

  • Increased cutting rate (2X)
  • Thinner kerf
  • Easier cleaning of wafers post sawing
  • Lower costs associated with slurry make-up, maintenance and disposal
  • Easier retrieval of silicon swarf for recycling

Post-sawn wafers are more easily rinsed on the beam and more easily cleaned afterwards in both pre-cleaning and final cleaning processes.  Properly developed low-foaming, non-staining easily filtered coolants can be recycled in a properly designed filtration system for use over a long period of time.  Properly designed coolant will not be carried off with the silicon swarf or on the wafers so maintenance of the coolant concentration is easy.



Vector HTA-D-S
SYNTHETIC LOW IFT, SOFT SETTLING COOLANT/LUBRICANT FOR DIAMOND WIRE SAWING SILICON








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