Ultimately, the individual die must be separated from the wafer for packaging. This singulation process is called dicing and is accomplished through the use of a dicing saw equipped with a circular, diamond-plated dicing blade.
In dicing, the wafer is mounted in a frame and placed under the saw. The blades rotates at 30K–60K RPM to cut a slot through the space between the die (known as a street) while using a dicing fluid/water mixture. Once all the die are singulated, the frame is rinsed or cleaned and the individual die are removed for packaging.
As wafers become larger and thicker, the time it takes to dice them into individual die increases. Subsequently, extended exposure to coolant during a dicing process increases the risk of corrosion and the formation of oxide, making bonding more difficult and device failure more prevalent. Thicker wafers and narrower streets can lead to chipping and cracking especially when using harder, thinner blades, resulting in device failure and decreased yield. Kerf material generated during dicing can stick to the bond pads making for difficult packaging/cleaning downstream. The use of a specialized dicing fluid, at economical dilution ratios of 200 parts water to one (200:1), will inhibit corrosion, keep the die clean, extend wheel life and decrease chipping and cracking for a dramatic increase in yield. Using an Intersurface Dynamics’ dicing fluid also eliminates the need for a CO2 injector and protects against electrostatic discharge (ESD).