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Silicon Wafer
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Certified By: ISO 9001:2015
Silicon Wafer

Edge Grinding

The edge grinding of silicon is necessary to bring the wafer into dimensional accuracy and to form a radius on the edge.  The radius helps to eliminate chipping and cracking in subsequent lapping and grinding processes.

Highly automated, high throughput edge grinders need to run at a constant temperature to ensure accuracy.  Much like ID saw blades, the edge of the grinding wheel is diamond-coated and a combination of the correct diamond abrasive and bonding matrix, along with the proper coolant/lubricant, is critical to process success.  In application, an edge grinding coolant/lubricant keeps the diamond-edged grinding wheel free cutting and clean, while promoting the proper fracturing of the diamond to expose new cutting edges.  It also helps to prevent chipping and cracking while forming the edge, which can lead to more extensive problems downstream, especially during lapping and surface grinding.  

Intersurface Dynamics has manufactured edge grinding coolants/lubricants for 20 years.  Inexpensive, safe and biodegradable, these products eliminate chipping and fracturing for the formation of a perfect beveled edge, extended wheel life and increased throughout.



Vector HTG
SYNTHETIC GRINDING FLUID


Vector HTI-1.1
"ONCE-THROUGH" NON RE-CIRCULATING SYNTHETIC COOLANT/LUBRICANT FOR FIXED DIAMOND ABRASIVE CROPPING AND SQUARING OF SILICON INGOTS USING ID, BAND AND WIRE SAWS. MAY ALSO BE USED AS A NON RE-CIRCULATING EDGE GRINDING COOLANT/LUBRICANT








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