Semiconductor
Silicon Wafer
Precision Optics - Technical Glass
Flat Panel Display
Ophthalmic
Flat Glass & Mirror
Solar Industry

Certified By: ISO 9001:2015
Silicon Wafer

Post-Saw Cleaning

No matter what sawing process is used to convert a silicon ingot into individual wafers, post-saw cleaning is essential.  Intersurface Dynamics manufactures detergents specifically developed to remove both process-generated particulate from the wire/slurry/silicon/epoxy interface, or the diamond/silicon/epoxy interface, along with residual organic material left from the liquid media.  If debris is left on the wafer, subsequent placement of the sawed wafer on to a lapping plate or grinding chuck can result in damage both to wafers and equipment.

Vector HTC-Plus
ULTRASONIC/MEGASONIC DETERGENT


Vector HTC-SCA Series
ULTRASONIC/MEGASONIC DETERGENTS








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