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Chemical Mechanical Polishing and Post-CMP Cleaning >> Tensor Clean/Rinse 3

DETERGENT FOR CLEANING CU AND BARRIER FILM COMPLEXES AND RESIDUE

Tensor Clean/Rinse 3 is an aqueous, acid based detergent designed to clean Cu and barrier film complexes formed on wafers and other surfaces. This unique, highly biodegradable formulation provides the surface wetting and detergency needed to remove inorganic and organic residue that forms on surfaces post-CMP, post-Thinning and post-Dicing.

Designed using dynamic contact angle measurement analysis coupled with data from specially designed electrochemical cells, TENSOR Clean/Rinse 3 can be used for cleaning the most complex device wafers (including MEMS) to the simplest tasks of keeping polishing pads clean after polishing. 

Benefits:

  • Superior wetting with low foam
  • Free Rinsing - leaves no film or residue
  • Fully compatible with most CMP Slurries and additives products
  • Ofers in-process protection of Cu of Al films without the use of BTA

Products Description:
TENSOR Clean/Rinse 3 is an aqueous acid based detergent that quickly wets out Cu and barrier film surfaces and removing oxide residue and complexes. Besides cleaning wafer surfaces TENSOR Clean/Rinse 3 can be used to clean and rinse polishing pads and machine areas. The pH of the TENSOR Clean/Rinse 3 is ~ 3.  The product can be used in concentrate form or diluted up to 4:1 depending upon its use.

Directions:
It is recommended that evaluation of TENSOR Clean/Rinse 3 begins with the concentrate and depending upon the results, moved to a more dilute form up to 4 parts DI water to 1 part TENSOR Clean/Rinse 3. Since the type and degree of residue to be removed varies, these factors will ultimately determine specific “in-house” dilutions. Other factors to consider include temperature, exposure time and functioning of the cleaning method or machinery (spray wash/brush-clean, ultrasonic or other mechanical cleaning system).

Additional Information:
TENSOR Series Products are available in 1-gallon bottles (4 to a case), 5-gallon pails and 55-gallon drums, F.O.B. Bethel, Connecticut, and also dicing and back-grinding additives, lapping additives, CMP oxidizers and additives, ultrasonic and megasonic detergents, and other rinse/wash detergents. Material Safety Data Sheets available upon request.



 



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