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Polishing >> Challenge 550-HT

LAPPING/POLISHING SLURRY ADDITIVE FOR RECIRCULATING SYSTEMS

CHALLENGE 550-HT was developed for use in “high-speed recirculating” and “high-speed once-through” slurry pumping systems.  Utilizing the energy of a high speed cirulating pump, standard on most lapping machines, it evenly disperses aluminum oxide, cerium oxide, silicon carbide, boron carbide, and garnet abrasive. It also reduces abrasive usage by eliminating “hard-packing” and waste. 

Benefits:

  • No scratching
  • Less sub-surface damage
  • No hard-packing
  • Less abrasive waste
  • Increased removal rate
  • Easier post-lap cleaning
  • Non-corrosive to machine

Directions:
CHALLENGE 550-HT is used at approximately 5% (by volume) with deionized (DI) water or tap water.  After CHALLENGE 550-HT is mixed with the water in the slurry tank, add the abrasive.  The slurry will be ready for use almost immediately. Start grain loading 400 g/liter for a one-meter machine.  Flow rate for the slurry should be approximately 300ml/minute for a one-meter machine.

Additional Information:
CHALLENGE Products are available in 5-gallon pails and 55-gallon drums, F.O.B. Bethel, Connecticut, and also include: grinding fluids, sawing fluids, rinse/wash agents and ultrasonic/megasonic detergents. Material Safety Data Sheets available upon request.



 



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